Method of cutting single crystals
US8097080B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2008 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Jul 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of dividing single crystals, particularly of plates of parts thereof, is proposed, which can comprise: pre-adjusting the crystallographic cleavage plane (2′) relative to the cleavage device, setting a tensional intensity (K) by means of tensional fields (3′, 4′), determining an energy release rate G(α) in dependence from a possible deflection angle (α) from the cleavage plane (2′) upon crack propagation, controlling the tensional fields (3′, 4′) such that the crack further propagates in the single crystal, wherein G(0)≧2γe(0) and simultaneously at least one of the following conditions is satisfied:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.