Patent · US Active

Method of cutting single crystals

US8097080B2 · kind B2 · utility

0Cited by
6References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 14, 2008
Grant dateJan 17, 2012
Priority date
Expiry dateJul 14, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31678
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method of dividing single crystals, particularly of plates of parts thereof, is proposed, which can comprise: pre-adjusting the crystallographic cleavage plane (2′) relative to the cleavage device, setting a tensional intensity (K) by means of tensional fields (3′, 4′), determining an energy release rate G(α) in dependence from a possible deflection angle (α) from the cleavage plane (2′) upon crack propagation, controlling the tensional fields (3′, 4′) such that the crack further propagates in the single crystal, wherein G(0)≧2γe(0) and simultaneously at least one of the following conditions is satisfied:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.