Method for abating effluent from an etching process
US8097179B2 · kind B2 · utility
3Cited by
24References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2009 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Jul 23, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01D2258/0216
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for abating effluent from an etching process in one embodiment includes advancing etch gas product into a passageway of a gas connector in direct fluid communication with a first chamber of an interior void of an apparatus, advancing a gas from a gas source into said passageway of said gas connector at the same time said etch gas product is being advanced into said passageway, and advancing humidified gas from a humidified gas source into a second chamber of said interior void.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.