Lightweight circuit board with conductive constraining cores
US8097335B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2010 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Feb 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2418
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.