Patent · US Active

In-mold label, and labeled resin-labeled article

US8097338B2 · kind B2 · utility

0Cited by

4References

17Claims

0Family size

Assignee

YUPO CORPORATION · JP

Inventors

Mitsuhiro Ashikaga · Ibaraki, JP
Naohide Ando · Ibaraki, JP
Yasuo Iwasa · Ibaraki, JP

Key dates

Filing date	May 20, 2005
Grant date	Jan 17, 2012
Priority date	—
Expiry date	Oct 10, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31938
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

An in-mold label comprising an olefinic resin substrate layer (A) having a wetting index (α) of from 34 to 74 mN/m and a heat-sealable resin layer (B) with an antistatic layer having a wetting index (β) of from 30 to 54 mN/m, wherein the absolute value of the initial frictional charge voltage of the substrate layer (A) relative to a sheet offset printing blanket is from 0 kV to 15 kV. This label has good workability in printing, cutting and blanking even in a low-humidity environment.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.