Metrology and 3D reconstruction of devices in a wafer
US8097846B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2009 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Aug 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for measuring three-dimensional devices in a wafer comprises the step of obtaining a plurality of cross-sectional images of a corresponding plurality of three-dimensional devices in the wafer. The plurality of three-dimensional devices have essentially identical geometries. Each cross-sectional image is obtained from a plane in the corresponding three-dimensional device at a predetermined distance from a fiducial mark thereof. The predetermined distance is different for each of the plurality of cross-sectional images. The method further comprises the step of determining the geometries of the plurality of three-dimensional devices based on the cross-sectional images thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.