Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component

US8097937B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Georg Bogner · Lappersdorf, DE
• Herbert Brunner · Sinzing, DE
• Michael Hiegler · Regensburg, DE
• Gunter Waitl · Regensburg, DE

Key dates

• Filing date: Oct 10, 2003
• Grant date: Jan 17, 2012
• Expiry date: Oct 10, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/856

Abstract

A leadframe, a housing, a radiation-emitting component formed therefrom, and a method for producing the component includes the leadframe having a mount part with at least one bonding wire connecting area and at least one electrical solder connecting strip into which a separately manufactured thermal connecting part, which has a chip mounting area, is linked. To form a housing, the leadframe is sheathed, preferably, with a molding compound, with the thermal connecting part being embedded such that it can be thermally connected from the outside.