Device and method for molding bistable magnetic alloy wire
US8099991B2 · kind B2 · utility
2Cited by
14References
13Claims
0Family size
Inventors
Key dates
| Filing date | Aug 31, 2007 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Jun 16, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5187
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Taught herein is a method for molding a bistable magnetic alloy wire, comprising: processing an alloy wire by heat treatment; and processing the alloy wire by cold treatment of mechanical twisting, the mechanical twisting being a repeated twisting in a continuous state. Also taught herein is a device for molding a bistable magnetic alloy wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.