Imprint embossing alignment system
US8100685B1 · kind B1 · utility
75Cited by
78References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2009 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Dec 6, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/219
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imprint embossing alignment system. In one embodiment, the system includes a die having a bottom surface, an embossing foil positioned above the bottom surface, and a mandrel, to receive the substrate, having a rod portion that extends through a central portion of the die. The system also includes a ball bushing positioned around the rod portion and a ring portion positioned between the ball bushing and the embossing foil to hold a precise alignment of a centerline of the rod portion and a centerline of the embossing foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.