Method of manufacturing bonded body and bonded body
US8101044B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2009 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Apr 13, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a bonded body is provided. The method comprising: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member with the aid of the liquid repellency of the liquid repellent region; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in the vicinity of a surface of the bonding film by applying energy thereto to thereby obtain the bonded body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.