Printed circuit board
US8101863B2 · kind B2 · utility
0Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2007 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Jul 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09236
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plurality of wiring patterns are formed on a first surface of a base insulating layer, and a ground layer is formed on a second surface opposite to the first surface. A cover insulating layer is then formed on the first surface of the base insulating layer so as to cover the plurality of wiring patterns. Further, a cover insulating layer is formed on the second surface of the base insulating layer so as to cover the ground layer. A high dielectric insulating layer having a dielectric constant of 10 to 30, for example, is then formed on the cover insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.