Laser-based material processing systems and methods for using such systems
US8101883B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2006 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Jul 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Laser-based material processing systems and methods for using such systems are disclosed herein. In one embodiment, for example, a laser-based material processing system includes a workpiece support, a positioning assembly over at least a portion of the workpiece support, and a laser. The system includes a laser beam director carried by the positioning assembly to direct a beam generated by the laser toward the workpiece support. The system also includes a dispensing unit carried by the positioning assembly to discharge a material toward the workpiece support. The system further includes a controller operably coupled to the positioning assembly, the laser beam director, and the dispensing unit. The controller can be configured to move the laser beam director and the dispensing unit relative to the workpiece support such that (a) the beam is directed toward a first portion of the workpiece support, and (b) the dispensing unit discharges material toward the first portion of the workpiece support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.