Microphone package with minimum footprint size and thickness
US8102015B2 · kind B2 · utility
9Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2008 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Sep 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone package includes a carrier, a cap, an integrated circuit chip, and a microphone unit. The cap covers the carrier to form a storage space. The integrated circuit chip is disposed in the storage space. The microphone unit is disposed in the storage space and stacked on the integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.