Equalization in proximity communication
US8102020B2 · kind B2 · utility
1Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2006 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Mar 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.