Bonded wafer structure and method of fabrication
US8102044B2 · kind B2 · utility
3Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2008 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Aug 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to create a void in the polymer. The method also comprises placing the first wafer over the second wafer and in contact with the polymer; and curing the polymer to bond the first wafer to the second wafer. A bonded wafer structure is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.