Encapsulated optoelectronic device and method for making the same
US8102119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2009 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Nov 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
An encapsulated optoelectronic device includes: a first barrier layer; an electroluminescence device coupled to the first barrier layer, and comprising a substrate and an electroluminescence element both defining a lateral side, and the electroluminescence element comprising a first electrode disposed on the substrate, a second electrode, and an optoelectronically active layer between the first and second electrodes; a second barrier layer coupled to the electroluminescence device; and an adhesive located between and connecting the first and second barrier layers, and at least coupled to the lateral side of the electroluminescence device to seal the electroluminescence device; a first conductive area electrically coupled to the first electrode and electrically insulated from the second electrode and a second conductive area; the second conductive area electrically coupled to the second electrode and electrically insulated from the first electrode and the first conductive area. A method for making the encapsulated optoelectronic device is presented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.