Microphone with reduced parasitic capacitance
US8103027B2 · kind B2 · utility
30Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2009 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Jul 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS microphone has an SOI wafer, a backplate formed in a portion of the SOI wafer, and a diaphragm adjacent to and movable relative to the backplate. The backplate has at least one trench that substantially circumscribes a central portion of the backplate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.