System and method for the on-machine 2-D contour measurement
US8103376B2 · kind B2 · utility
5Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2008 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Jul 13, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a system and method for the on-machine 2-D contour measurement, employing the contour measurement, coordinate system transformation, error identification, and image matching theory in image processing field to develop the on-machine measurement of X-Y-plan manufacturing error of a micro device manufactured by a high-precision micro-device machine tool, contour error, and trace error.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.