Handling layer and adhesive parts formed therewith
US8105460B2 · kind B2 · utility
8Cited by
41References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2007 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Sep 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1043
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A handling layer and adhesive parts having the handling layer are formed according to the present invention along with used therefore.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.