Method for making a forming structure
US8105526B2 · kind B2 · utility
27Cited by
68References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2009 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Jul 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for making a forming structure. The steps of the method include providing a forming unit, providing a backing film, providing a foraminous element, employing liquid photosensitive resin to form the forming structure, and laser machining a plurality of generally columnar protrusions into the forming structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.