Patent · US Active

Microreactor assembly incorporating interconnect backbone and diverse fluidic microstructures

US8105557B2 · kind B2 · utility

1Cited by
0References
13Claims
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Assignee

Inventors

Key dates

Filing dateJan 28, 2009
Grant dateJan 31, 2012
Priority date
Expiry dateJan 14, 2030

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2237/32
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

A microreactor assembly [100] is provided comprising a fluidic interconnect backbone [10] and plurality of fluidic microstructures. Interconnect input/output ports [12] of the fluidic interconnect backbone [10] are interfaced with microchannel input/output ports [14] of the fluidic microstructures at a plurality of non-polymeric interconnect seals [50]. Interconnect microchannels [15] are defined entirely by the fluidic interconnect backbone [10] and extend between the non-polymeric interconnect seals [50] without interruption by additional sealed interfaces. At least one of the fluidic microstructures [20, 30, 40] may comprise a mixing microstructure formed by a molding process. Another of the fluidic microstructures [20, 30, 40] may comprise an extruded reactor body. Still another fluidic microstructure [20, 30, 40] may comprise a quench-flow or hydrolysis microreactor formed by a hot-pressing method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.