Method for etching a see-through thin film solar module
US8105863B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 8, 2010 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Jul 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
This invention discloses a method for etching a see-through thin film solar module, comprising: printing ink paste which resists the etching of etching solutions in the protected area of the thin film solar module which is placed under a screen; drying and solidifying the ink paste; coating etching solutions on the thin film solar module; and removing the ink paste. The method of this invention can accurately position the see-through area, achieve various selections of see-through patterns, facilitate the realization of the see-through function in large-area thin film solar modules, and alleviate the problem that a short circuit easily occurs in a see-through thin film solar module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.