Patent · US Active

Connecting and bonding adjacent layers with nanostructures

US8106517B2 · kind B2 · utility

12Cited by

12References

10Claims

0Family size

Assignee

Smoltek AB · SE

Inventors

Mohammad Shafiqul Kabir · Gothenburg, SE
Andrzej Brud · Alvesta, SE

Key dates

Filing date	Sep 12, 2008
Grant date	Jan 31, 2012
Priority date	—
Expiry date	Sep 17, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24174
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.