Integrating capacitors into vias of printed circuit boards
US8107254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2008 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Jun 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hole characterized by a generally tubular inner surface; a capacitor integrated within the via, the capacitor including two capacitor plates, an inner plate and an outer plate, the two plates composed of electrically conductive material disposed upon the inner surface of the via hole, both plates traversing layers of the laminate, the inner plate traversing more layers of the laminate than are traversed by the outer plate; and a layer of dielectric material disposed between the two plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.