Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing
US8107800B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2008 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Aug 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.