Patent · US Active

Enhanced conductivity in an airgapped integrated circuit

US8108820B2 · kind B2 · utility

2Cited by

16References

20Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Axel Aguado Granados · Rochester, US
Benjamin A. Fox · Rochester, US
Nathaniel J. Gibbs · Rochester, US
Andrew Benson Maki · Rochester, US
Trevor Joseph Timpane · Rochester, US

Key dates

Filing date	Sep 11, 2008
Grant date	Jan 31, 2012
Priority date	—
Expiry date	Jun 23, 2030

Classification

Technology area (CPC G)Physics
CPC primaryG06F30/392
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method, program product and apparatus include extending lengths that project from a microchip trace into dielectric material. The extending lengths may not connect to another trace. Placement of the extending lengths may be optimized to increase the dissipation of heat from the trace, while maintaining an acceptable level of capacitance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.