Contact stress sensor
US8109149B2 · kind B2 · utility
24Cited by
3References
54Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 19, 2008 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | May 25, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a thermal compensator and a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.