Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
US8109321B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2008 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Nov 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular heat sink assembly is disclosed. The heat sink assembly includes a main (larger) heat sink member having one or more voids through the member. The heat sink assembly also includes one or more additional (smaller) heat sink members that fit within the voids of the main heat sink member and are able to move (float) within the voids while thermally connected to main heat sink member. The thermal connection to the main heat sink member may be accomplished by incorporating heat pipes as a bridge between the heat sink members, so that heat spreading, and regulation thereof, occurs over the additional heat sink members and the main heat sink member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.