Method of cutting target members using a cutting saw device
US8109693B1 · kind B1 · utility
14Cited by
17References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 12, 2011 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Apr 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9292
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.