Substrate supporting device and sputtering apparatus including the same
US8110078B2 · kind B2 · utility
1Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2008 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | May 8, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/505
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate supporting device for forming a coating film having a maximally even and necessary thickness with a sufficiently strong adhesiveness and a good film quality on a substrate, and a sputtering apparatus including such a substrate supporting device. The substrate supporting device for supporting a substrate on which a coating film is formed by sputtering is disposed in a vacuum chamber so as to be opposed to a sputtering target. The substrate supporting device is rotatable around a first rotation axis by a first driving mechanism and is rotatable around a second rotation axis by a second driving mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.