AC impedance spectroscopy testing of electrical parametric structures
US8110416B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2008 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Feb 19, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2843
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Defects in components in ICs which may cause circuit failures during operation of the IC are often difficult to detect during and immediately after fabrication of the IC by DC test methods. A method of testing components to detect such defects using AC Impedance Spectroscopy is disclosed. Data may be analyzed using Nyquist plots and Bode plots. Nyquist plots of typical defect types are disclosed. Components may include MOS transistor gate structures, contacts, vias and metal interconnect lines. Components tested may be contained in integrated circuits or in test circuits. Integrated circuits containing components tested by AC Impedance Spectroscopy may be partially fabricated or deprocessed after fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.