Hot melt pressure sensitive adhesive composition that includes vegetable wax and articles including the same
US8110623B2 · kind B2 · utility
4Cited by
18References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2007 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Jan 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31902
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A hot melt pressure-sensitive adhesive composition that includes thermoplastic polymer, tackifying agent, plasticizer oil, and from at least 5% by weight to about 25% by weight vegetable wax.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.