Through substrate optical imaging device and method
US8110804B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Nov 22, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9505
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A through-substrate optical imaging device for through-imaging of translucent work objects, includes a radiation source outputting radiation that will be transmissive through the work object and an imaging system configured for capturing inspection information from the radiation source through the work object. The radiation source is configured such that the radiation impinges on the surface of the work object under various angles of incidence. A method for through-substrate optical imaging of a translucent work object includes irradiating the translucent work object by radiation from a radiation source; capturing inspection information from the radiation source through the translucent work object, the inspection information being captured by an imaging system; and irradiating the translucent work object. The translucent work object is irradiated by radiation which impinges on the surface of the translucent work object under one of various angles of incidence and orientations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.