Photodiode with integrated semiconductor circuit and method for the production thereof
US8110886B2 · kind B2 · utility
1Cited by
7References
7Claims
0Family size
Assignee
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Key dates
| Filing date | May 23, 2006 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Apr 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/809
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor circuit in a semiconductor body and a wafer bonding method for connecting the semiconductor circuit to another substrate, in which a diode is realized in a laminar structure. The semiconductor circuit is connected to the terminals of the diode by means of feedthroughs that extend through the semiconductor body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.