Semiconductor module
US8110929B2 · kind B2 · utility
4Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2008 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Aug 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes: a substrate having a wiring layer; a first rectangular-shaped semiconductor device mounted on one surface of the substrate; a second rectangular-shaped semiconductor device mounted on the other surface of the substrate. The first semiconductor device is arranged such that each side thereof is not parallel to that of the second semiconductor device, and that the first semiconductor device is superimposed on the second semiconductor device, when seen from the direction perpendicular to the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.