Thermal head, printer, and manufacturing method for thermal head
US8111273B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2009 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Jul 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
To achieve improvements in heating efficiency and strength against external load, provided is a thermal head (1), comprising: a supporting substrate (3) having a surface in which a concave portion (2) is formed; a heat storage layer (5) bonded onto the surface of the supporting substrate (3); a heating resistor provided in a region, which is opposed to the concave portion (2) of the supporting substrate (3), on the heat storage layer (5); and a protruding portion (2A), which is provided inside a hollow portion formed between the supporting substrate (3) and the heat storage layer (5) by the concave portion (2), and comes into contact with the heat storage layer (5) and limits deflection of the heat storage layer (5) when the heating resistor is pressurized by predetermined load or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.