Electronic component and tape head having a closure
US8111480B2 · kind B2 · utility
0Cited by
17References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2008 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Nov 7, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/022
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.