Computer housing
US8111505B2 · kind B2 · utility
8Cited by
39References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Aug 25, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A multipart computer housing is described. The multipart computer housing includes at least a structural support layer and a body. The body includes at least an outer layer formed of lightweight flexible material and an inner layer attached to the outer layer. The inner layer is connected to the support layer forming a load path between the inner layer and the structural support layer. A load applied to the multipart computer housing is transferred by way of the load path to the support layer without substantially affecting the outer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.