Back-up device for use in a melt distribution apparatus of an injection molding system
US8113819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2009 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Jun 5, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2889
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed, amongst other things, is a back-up device that is configured to provide a structural support, in use, between a manifold and a housing member within a melt distribution apparatus of an injection molding system. The back-up device is associated, in use, with a valve-gate apparatus within a nozzle drop. The back-up device includes a cold-side member formed from a first material and a hot-side member formed from a second material. The first material is more thermally conductive than the second material. The cold-side member is configured to be thermally connectable, in use, with the housing member and the hot-side member. The hot-side member is configured to be thermally connectable, in use, with the manifold and the cold-side member. The hot-side member is also configured to prevent the cold-side member from directly contacting the manifold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.