Method of monitoring a substrate patterning process
US8114267B2 · kind B2 · utility
6Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2007 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Dec 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for monitoring a substrate patterning process, where at least two electrodes are used to apply a voltage to the substrate to cause a reaction in a portion of the substrate, that includes recording a current driven by said voltage as a function of time and/or as a function of a position of the substrate or a patterning mask. Also disclosed are a device and a computer program product for monitoring the substrate patterning process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.