Substrates with multiple images
US8114502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2004 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Jul 19, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application is directed to substrates comprising light shielding areas and light transmitting areas. In one embodiment, the present application is directed to a substrate comprising a film comprising a light shielding additive. The film comprises a structured surface resulting in thick light shielding areas and relatively thin light transmitting areas. In another embodiment, the present application is directed to a substrate comprising a film comprising a first major surface that is structured with a series of microstructure features and he substrate has light shielding layer is on the first major surface in the light shielding areas. In another embodiment, the light transmitting areas are series of holes through the film having at least two lateral dimensions less than 1.4 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.