Resin composition, laminate using the same, and molded body using the laminate
US8114522B2 · kind B2 · utility
10Cited by
10References
4Claims
0Family size
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Key dates
| Filing date | Feb 16, 2009 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Feb 16, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a resin composition forming an adhesive layer between a polylactic acid resin substrate layer and a polyolefin resin substrate layer. The resin composition includes a modified polyolefin resin (A) and a terpene resin (B), and the mass ratio (A)/(B) between the both resins (A) and (B) is 20/80 to 99/1. Alternatively, the resin composition may be a resin composition including 10 to 90% by mass of a polylactic acid resin (C), 5 to 89% by mass of the modified polyolefin resin (A) and 1 to 80% by mass of a hydrogenated petroleum resin (D), with the total amount of these resins constrained to be 100% by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.