Method of preparing a substrate for lithography, a substrate, a device manufacturing method, a sealing coating applicator and a sealing coating measurement apparatus
US8114568B2 · kind B2 · utility
11Cited by
8References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2008 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | May 14, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70341
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate for use in a lithographic projection apparatus. The substrate includes a sealing coating that covers at least a part of a first interface between two layers on the substrate, or between a layer and the substrate, and does not extend to a central portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.