Light emitting diode package and method of manufacturing the same
US8115214B2 · kind B2 · utility
1Cited by
9References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 23, 2007 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Apr 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.