Systems and methods for packaging light-emitting diode devices

US8115217B2 · kind B2 · utility

Assignee

• ILLUMITEX, INC. · US

Inventors

• Dung Duong · Austin, US
• Paul N. Winberg · Rollingwood, US
• Oscar Vaz · Austin, US

Key dates

• Filing date: Dec 11, 2009
• Grant date: Feb 14, 2012
• Expiry date: Mar 25, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8514

Abstract

Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out from the top, phosphor deposition and color temperature control can be significantly simplified. A package LED may include a housing positioned on a supporting submount, sized and dimensioned to accommodate a single LED chip or an array of LED chips. The LED chip(s) may be attached to the submount utilizing the Gold-to-Gold Interconnect (GGI) process or solder-based approaches. In some embodiments, phosphor may be deposited on top of the LED chip(s) or sandwiched between glass plates on top of the LED chip(s). The phosphor layer may be inside or on top of the housing and be secured to the housing utilizing an adhesive. The housing may be adhered to the submount utilizing a thermal epoxy.