Light emitting diode package structure and method for fabricating the same

US8115218B2 · kind B2 · utility

Assignee

• Industrial Technology Research Institute · TW

Inventors

• Yao-Jun Tsai · Taoyuan, TW
• Chen-Peng Hsu · Hsinchu, TW
• Chao-Wei Li · Taipei, TW
• Hung-Lieh Hu · Hsinchu, TW

Key dates

• Filing date: Jul 13, 2009
• Grant date: Feb 14, 2012
• Expiry date: Apr 28, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8585

Abstract

A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.