Method to form an interconnect
US8115313B2 · kind B2 · utility
0Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2006 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Jun 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/773
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of electrodes are electrically coupled to each other by conductive interconnects formed from selectively sintered nanoparticles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.