Packaging board, semiconductor module, and portable apparatus
US8115316B2 · kind B2 · utility
4Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2007 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | May 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed on a substrate; an insulating layer covering the substrate, having an opening at least in part in an area over the pad electrode; and a joint layer formed on the pad electrode inside the opening. The surface of the joint layer is lower than the top lip of the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.