Flexible substrates having a thin-film barrier
US8115326B2 · kind B2 · utility
11Cited by
75References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2007 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Nov 17, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.