Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology
US8116090B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2009 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Jun 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system is provided for the integration of microwave components in a low temperature co-fired ceramic, the system includes a low temperature co-fired ceramic body having a top surface, into which is disposed a plurality of cavities; a plurality of microwave devices, each device being disposed within a cavity such that the cavities provide radio isolation to the devices; and a coaxial connection disposed within the body configured to connect the devices to external components the coaxial components comprising vias disposed within the co-fired ceramic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.