Apparatus for electrically coupling a semiconductor package to a printed circuit board
US8116097B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2007 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | May 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The plurality of connections is arranged in a grid array. The interposer further includes a plurality of plated through holes. The apparatus further includes a substrate having a plurality of pins. The substrate is coupled to the interposer by inserting each of the plurality of pins into a corresponding one of the plurality of plated through holes of the interposer. An IC package including an IC is mounted on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.